Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2022
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Application #:
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16483027
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Filing Dt:
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08/01/2019
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Inventors:
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Fei Qin, Lixiang Zhang, Shuai Zhao, Pei Chen, Tong An, Yanwei Dai
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Title:
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Device And Method For On-line Measurement Of Wafer Grinding Force
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 100 PINGLEYUAN, CHAOYANG DISTRICT |
| BEIJING, CHINA |
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| WEN IP LLC |
| 7710 80TH PL SE |
| MERCER ISLAND, WA 98040 |
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06/20/2024 02:36 AM
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