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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/02/2022
Application #:
16914725
Filing Dt:
06/29/2020
Inventors:
Wu Hu Li, Olaf Hohlfeld, Ivan Nikitin, Raphael Hellwig, Martin Mayer
Title:
Power Module with Metal Substrate
Assignment: 1
Reel/Frame:
053124/0781Recorded: 07/06/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/30/2020
Exec Dt:
06/29/2020
Exec Dt:
06/30/2020
Exec Dt:
06/30/2020
Exec Dt:
06/29/2020
Assignee:
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON
1255 CRESCENT GREEN, SUITE 200
CARY, NC 27518

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