Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2022
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Application #:
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17190804
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Filing Dt:
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03/03/2021
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Inventor:
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Ivan Nikitin
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Title:
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MOLDED SEMICONDUCTOR MODULE FOR PCB EMBEDDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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MURPHY, BILAK & HOMILLER, PLLC |
1255 CRESCENT GREEN, SUITE 200 |
CARY, 27518 UNITED STATES |
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06/15/2024 11:10 PM
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