Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2022
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Application #:
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17181039
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Filing Dt:
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02/22/2021
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Inventors:
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Sui-Ho Tsai, Cheng-Neng Chen, Yun-Nan Wang, Chih-Yuan Chao, Hsueh-Tsung Lu
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Title:
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Double-sided and Multilayer Flexible Printed Circuit (FPC) Substrate and Method of Processing the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2288, LUHENG ROAD, ECONOMIC DEVELOPMENT ZONE |
| CHANGZHOU CITY, JIANGSU PROVINCE, CHINA |
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| MAYER & WILLIAMS, P.C. |
| 55 MADISON AVENUE, SUITE 400 |
| MORRISTOWN, NJ 07960 |
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