Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2022
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Application #:
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15907717
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Filing Dt:
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02/28/2018
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Publication #:
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Pub Dt:
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05/16/2019
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Inventors:
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Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE INCLUDING AN INTEGRATED CIRCUIT DIE SOLDERED TO A BOND PAD OF A REDISTRIBUTION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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