Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2022
|
Application #:
|
17094101
|
Filing Dt:
|
11/10/2020
|
|
Publication #:
|
|
Pub Dt:
|
09/16/2021
| | | | |
|
Inventors:
|
Shih-Chun CHEN, Sheng-Tou TSENG, Kun-Chi HSU, Chin-Ta WU, Ying-Lin CHEN, Ting-Yeh WU
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING PARTIAL OUTER METAL LAYER AND PACKAGING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.10, DATONG RD. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
|
|
|
|
| PATENTTM.US JAMES H. WALTERS |
| 205 SE SPOKANE ST STE 300 |
| PORTLAND, OR 97202-6487 |
|
|
Search Results as of:
06/16/2024 03:42 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
