Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2022
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Application #:
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16893176
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Filing Dt:
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06/04/2020
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Publication #:
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Pub Dt:
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12/31/2020
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Inventor:
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Chia-Shuai CHANG
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Title:
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IMAGE SENSING CHIP PACKAGE STRUCTURE INCLUDING ADHESIVE LOOP
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST. |
TAIPEI CITY, TAIWAN |
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HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
45 SOUTH SEVENTH STREET |
SUITE 2700 |
MINNEAPOLIS, MN 55402-1683 |
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06/27/2024 12:37 PM
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