Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2022
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Application #:
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17433804
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Filing Dt:
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08/25/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Inventors:
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Akira Kitashima, Takao Maeda
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Title:
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LASER BONDING METHOD AND LASER BONDING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 98-1, EDO-MACHI, CHUO-KU, KOBE-SHI |
| HYOGO, JAPAN 650-0033 |
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| THOMAS K. SCHERER |
| 909 FANNIN ST. |
| SUITE 3500 |
| HOUSTON, TX 77010 |
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