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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/23/2022
Application #:
16779783
Filing Dt:
02/03/2020
Inventors:
Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER et al
Title:
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
Assignment: 1
Reel/Frame:
051697/0830Recorded: 02/03/2020Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/25/2016
Exec Dt:
03/29/2016
Exec Dt:
03/29/2016
Exec Dt:
03/25/2016
Exec Dt:
03/28/2016
Exec Dt:
03/25/2016
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
FLEIT INTELLECTUAL PROPERTY LAW
4800 N. FEDERAL HIGHWAY, SUITE B306
BOCA RATON, FL 33431

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