Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/13/2022
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Application #:
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16840752
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Filing Dt:
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04/06/2020
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Publication #:
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Pub Dt:
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10/07/2021
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Inventors:
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Aniket PATIL, Hong Bok WE, Kuiwon KANG
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Title:
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PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDER RESIST LAYER AND AN INTEGRATED DEVICE COUPLED TO THE SUBSTRATE AND METHOD FOR MANUFACTURING THE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| LOZA & LOZA LLP |
| 305 NORTH SECOND AVENUE #127 |
| UPLAND, CA 91786 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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