Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/20/2022
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Application #:
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16581594
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Filing Dt:
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09/24/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Inventors:
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Kuei-Wei CHEN, Chia-Sheng LIN, Chia-Ming CHENG
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Title:
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CHIP PACKAGE WITH SUBSTRATE HAVING FIRST OPENING SURROUNDED BY SECOND OPENING AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
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| WEN LIU |
| 350 S. FIGUEROA STREET, SUITE 975 |
| LOS ANGELES, CA 90071 |
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