Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/20/2022
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Application #:
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17001784
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Filing Dt:
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08/25/2020
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Publication #:
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Pub Dt:
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12/10/2020
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Inventors:
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Yao-Tsung HUANG, Ming-Cheng LEE, Cheng-Tien WAN, Yun-San HUANG, Wei-Che HUANG
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 280 INTERSTATE NORTH CIRCLE SE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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