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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11452239
Issue Dt:
09/20/2022
Application #:
16618181
Filing Dt:
11/29/2019
Publication #:
20200113084
Pub Dt:
04/09/2020
Inventors:
Jisheng He, Chen Wang, Peng Zhang, Hongjie Wu, Jingnan Peng, Xing Li, Zhen Sun, Xintao Cui
Title:
METHOD FOR ENHANCING BOILING PERFORMANCE OF CHIP SURFACE
Assignment: 1
Reel/Frame:
051146/0398Recorded: 12/01/2019Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HE, JISHENG
Exec Dt:
11/18/2019
WANG, CHEN
Exec Dt:
03/26/2019
ZHANG, PENG
Exec Dt:
11/18/2019
WU, HONGJIE
Exec Dt:
04/02/2019
PENG, JINGNAN
Exec Dt:
03/06/2019
LI, XING
Exec Dt:
03/06/2019
SUN, ZHEN
Exec Dt:
04/02/2019
CUI, XINTAO
Exec Dt:
03/06/2019
Assignee:
SUGON DATAENERGY(BEIJING) CO., LTD
NO. 36, ZHONGGUANCUN SOFTWARE PARK
NO 8, DONGBEIWANG WEST ROAD, HAIDIAN DISTRICT
BEIJING, CHINA 100094
Correspondent:
BYIP LTD.
5700 GRANITE PARKWAY, SUITE 200
PLANO, TX 75024

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