Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/04/2022
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Application #:
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17082494
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Filing Dt:
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10/28/2020
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Publication #:
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Pub Dt:
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04/29/2021
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Inventors:
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Hyeonjin SHIN, Minhyun LEE, Changseok LEE, Hyeonsuk SHIN, Seokmo HONG
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Title:
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INTERCONNECT STRUCTURE AND ELECTRONIC APPARATUS INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MICHAEL A. VARCO |
| 11730 PLAZA AMERICA DRIVE, SUITE 600 |
| HARNESS, DICKEY & PIERCE, P.L.C. |
| RESTON, VA 20190 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 50, UNIST-GIL, EONYANG-EUP, ULJU-GUN, |
| ULSAN, KOREA, REPUBLIC OF 44919 |
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| MICHAEL A. VARCO |
| 11730 PLAZA AMERICA DRIVE, SUITE 600 |
| HARNESS, DICKEY & PIERCE, P.L.C. |
| RESTON, VA 20190 |
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