Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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17121804
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Filing Dt:
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12/15/2020
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Publication #:
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Pub Dt:
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06/24/2021
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Inventors:
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Jun Kyu LEE, Su Yun Kim, Dong Hoon OH, Yong Tae KWON, Ju Hyun NAM
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 105, GEUMIL-RO 965BEON-GIL, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, |
| SAMSEONG-MYEON, KOREA, REPUBLIC OF 27651 |
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| GOKALP BAYRAMOGLU |
| 1540 WEST WARM SPRINGS ROAD |
| SUITE 100 |
| HENDERSON, NV 89014 |
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