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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/01/2022
Application #:
16950213
Filing Dt:
11/17/2020
Publication #:
Pub Dt:
03/11/2021
Inventors:
Kuei-Sung Chang, Chia-Hua Chu, Shang-Ying Tsai
Title:
METHOD OF MAKING OHMIC CONTACT ON LOW DOPED BULK SILICON FOR OPTICAL ALIGNMENT
Assignment: 1
Reel/Frame:
054391/0134Recorded: 11/17/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/25/2019
Exec Dt:
07/25/2019
Exec Dt:
07/25/2019
Assignee:
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
ESCHWEILER & POTASHNIK, LLC
ROSETTA CENTER
629 EUCLID AVE., SUITE 1000
CLEVELAND, OH 44114

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