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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11490503
Issue Dt:
11/01/2022
Application #:
17204058
Filing Dt:
03/17/2021
Publication #:
20220022310
Pub Dt:
01/20/2022
Inventors:
Chi Seong Kim, Yo Han Song, Jae Heun LEE, Jin Oh Park, Chang Hwa Park, Eun Heay Lee et al
Title:
SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN
Assignment: 1
Reel/Frame:
055634/0239Recorded: 03/18/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, CHANG HWA
Exec Dt:
10/29/2020
KIM, CHI SEONG
Exec Dt:
10/20/2020
LEE, EUN HEAY
Exec Dt:
10/20/2020
SONG, YO HAN
Exec Dt:
10/20/2020
HYUNG, GUN HWI
Exec Dt:
10/20/2020
LEE, JAE HEUN
Exec Dt:
10/20/2020
KANG, DEOK MAN
Exec Dt:
10/20/2020
PARK, JIN OH
Exec Dt:
10/26/2020
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE NW
WASHINGTON, DC 20004

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