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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/08/2022
Application #:
15833003
Filing Dt:
12/06/2017
Publication #:
Pub Dt:
05/17/2018
Inventors:
William Henderson, Ling Feng, Andrew Dovey
Title:
LARGE PART INJECTION MOLD APPARATUS AND PROCESS
Assignment: 1
Reel/Frame:
046452/0317Recorded: 06/26/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Exec Dt:
06/15/2018
Assignee:
10 CENTENNIAL DRIVE
PEABODY, MASSACHUSETTS 01960
Correspondent:
THERESE A. HENDRICKS
ONE INTERNATIONAL PLACE
SUITE 3900
BOSTON, MA 02110
Assignment: 2
Reel/Frame:
064950/0142Recorded: 09/19/2023Pages: 16
Conveyance:
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS
Assignors:
Exec Dt:
08/31/2023
Exec Dt:
08/31/2023
Assignee:
900 W TRADE STREET
GATEWAY VILLAGE-900 BUILDING NC1-026-06-09
CHARLOTTE, NORTH CAROLINA 28255
Correspondent:
STEWART WALSH
1025 CONNECTICUT AVE NW, SUITE 712
COGENCY GLOBAL INC.
WASHINGTON, DC 20036

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