Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/08/2022
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Application #:
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16971162
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Filing Dt:
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08/19/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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Seung Uk Yeu, Yong Seok Jung, Won Sang Kwon, Seung Whan Oh, Jung Su Han
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Title:
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Latex Composition for Dip Molding, a Method of Preparing the Same, and Molded Article Therefrom
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO |
| YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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