Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/15/2022
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Application #:
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17175914
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Filing Dt:
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02/15/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Inventors:
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Chae Sung LEE, Jong Hoon KIM
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17336 |
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WILLIAM PARK & ASSOCIATES LTD. |
930 N. YORK ROAD, SUITE 201 |
HINSDALE, IL 60521 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9330 LBJ FREEWAY |
SUITE 900 |
DALLAS, TEXAS 75243 |
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ROBERT D. LEONARD |
VOLPE KOENIG |
30 SOUTH 17TH STREET, 18TH FLOOR |
PHILADELPHIA, PA 19103 |
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09/23/2024 04:30 PM
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