Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/22/2022
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Application #:
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17162014
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Filing Dt:
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01/29/2021
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Publication #:
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Pub Dt:
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05/20/2021
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Inventor:
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Weng-Jin WU
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Title:
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MOLDED IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS
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Assignment:
1
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RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 056595, FRAME 0177
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| 5005 EAST MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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| JOANNE HADDAD/WHITE & CASE LLP |
| 1221 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10020 |
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