Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16463439
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Filing Dt:
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05/23/2019
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Publication #:
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Pub Dt:
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04/22/2021
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Inventors:
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Xi YANG, Junyou PAN
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Title:
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FUSED RING COMPOUND, HIGH POLYMER, MIXTURE, COMPOSITION AND ORGANIC ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 602, BUILDING G8, SOUTH CHINA NEW MATERIAL INNOVATION PARK |
| 31 KEFENG ROAD, SCIENCE CITY, HIGH-TECH INDUSTRIAL DEVELOPMENT ZONE |
| GUANGZHOU, GUANGDONG, CHINA 510663 |
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| JEFFREY GENDZWILL |
| KILPATRICK TOWNSEND & STOCKTON LLP |
| 607 14TH STREET, NW, STE 900 |
| WASHINGTON, DC 20005-2018 |
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