Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/13/2022
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Application #:
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16868038
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Filing Dt:
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05/06/2020
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Publication #:
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Pub Dt:
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09/30/2021
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Inventors:
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Cho-Hsin Chang, Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu
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Title:
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ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| SCOTT W. KELLEY |
| 6320 CANOGA AVENUE |
| SUITE 1650 |
| WOODLAND HILLS, CA 91367 |
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