Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17171096
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Filing Dt:
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02/09/2021
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Publication #:
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Pub Dt:
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06/03/2021
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Inventors:
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Lei-Chun Chou, Chih-Ming Lai, Chin-Yuan Tseng, Shi Ning Ju, Kam-Tou Sio, Wei-Cheng Lin et al
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Title:
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High-Density Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| JONES DAY |
| 250 VESEY STREET |
| NEW YORK, NY 10281-1047 |
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