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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/27/2022
Application #:
16769051
Filing Dt:
06/02/2020
Publication #:
Pub Dt:
07/29/2021
Inventors:
Chun Ho PARK, Yu Jin JEONG, Jin Mi JUNG, Jae Jung YOO, Seung Yong LEE, Bu Won SON et al
Title:
JOINING MATERIAL FOR LASER WELDING AND LASER WELDING METHOD USING THE SAME
Assignment: 1
Reel/Frame:
062086/0459Recorded: 12/14/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/23/2020
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
DENTONS US LLP
1900 K STREET NW
IP GROUP
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
052888/0528Recorded: 06/10/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/08/2020
Exec Dt:
05/29/2020
Exec Dt:
05/08/2020
Exec Dt:
05/29/2020
Exec Dt:
04/14/2020
Exec Dt:
05/08/2020
Exec Dt:
04/14/2020
Assignees:
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
ONE IFC,
10, GUKJEGEUMYUNG-RO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07326
Correspondent:
DENTONS US LLP
1900 K. STREET, NW
WASHINGTON, DC 20006

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