Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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16462209
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Filing Dt:
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05/17/2019
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Publication #:
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Pub Dt:
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10/31/2019
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Inventors:
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Cheol Min Park, Hyo Moon Nam, Buem Jae Lee, Hyo Young Kim
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Title:
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METHOD OF TIN-PLATING COPPER ALLOY FOR ELECTRIC OR ELECTRONIC PARTS AND AUTOMOBILE PARTS AND TIN-PLATING MATERIAL OF COPPER ALLOY MANUFACTURED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 134, PYEONGTAEKHANG-RO, 156BEON-GIL |
| POSEUNG-EUP |
| PYEONGTAEK-SI, KOREA, REPUBLIC OF 17960 |
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| LOEB & LOEB |
| 321 N. CLARK STREET |
| SUITE 2300 |
| CHICAGO, IL 60654 |
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