Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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17102726
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Filing Dt:
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11/24/2020
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Publication #:
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Pub Dt:
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03/18/2021
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Inventors:
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Vipul Vijay MEHTA, Sanka GANESAN, Robert Leon SANKMAN, Eric Jin LI, Debendra MALLIK
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Title:
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SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DIE MOUNT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW 5TH AVENUE, STE. 1600 |
| PORTLAND, OR 97204 |
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