Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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17330855
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Filing Dt:
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05/26/2021
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Publication #:
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Pub Dt:
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12/02/2021
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Inventors:
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CHIH-HUNG CHIU, CHIH-HSUN CHU, WUN-KAI WANG, HSIANG-JEN CHENG
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Title:
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OSCILLATOR WAFER-LEVEL-PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F., NO. 16, SEC. 2, CHUNG YANG S. RD. |
| PEITOU 112 |
| TAIPEI, TAIWAN |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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