Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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16877670
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Filing Dt:
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05/19/2020
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Publication #:
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Pub Dt:
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11/25/2021
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Inventors:
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Meng-Pei Lu, Ming-Han Lee, Shin-Yi Yang, Tz-Jun Kuo
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Title:
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VIA STRUCTURE AND METHODS FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN 6 ROAD |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN ROC 30077 |
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THE MARBURY LAW GROUP, PLLC |
11800 SUNRISE VALLEY DRIVE |
15TH FLOOR |
RESTON, VA 20191 |
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