Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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16713527
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Filing Dt:
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12/13/2019
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Publication #:
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Pub Dt:
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06/25/2020
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Inventor:
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Yu-Hui WU
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Title:
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Component Carrier Comprising Pillars on a Coreless Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 58 CHANG HE ROAD |
| CHONGQING, CHINA 401133 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
| 50 GLENLAKE PARKWAY |
| SUITE 340 |
| ATLANTA, GA 30328 |
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