Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/17/2023
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Application #:
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17124622
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Filing Dt:
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12/17/2020
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Publication #:
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Pub Dt:
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07/08/2021
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Inventors:
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JIE HU, MOHAMMAD GHARAVI-ALKHANSARI
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Title:
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THREE-DIMENSIONAL (3D) SHAPE MODELING BASED ON TWO-DIMENSIONAL (2D) WARPING
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1-7-1 KONAN |
| MINATO-KU |
| TOKYO, JAPAN 1080075 |
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| CHIP LAW GROUP |
| 505 N LAKESHORE DR |
| SUITE 250 |
| CHICAGO, IL 60611 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7-1 KONAN |
| MINATO-KU |
| TOKYO, JAPAN 1080075 |
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| CHIP LAW GROUP |
| 505 N LAKESHORE DR |
| SUITE 250 |
| CHICAGO, IL 60611 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7-1 KONAN, MINATO-KU |
| TOKYO, JAPAN 108-0075 |
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| 25 MADISON AVENUE |
| NEW YORK, NEW YORK 10010 |
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| SONY CORPORATION OF AMERICA |
| 16535 VIA ESPRILLO |
| MZ 1029 |
| SAN DIEGO, CA 92127 |
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