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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/24/2023
Application #:
17298178
Filing Dt:
05/28/2021
Publication #:
Pub Dt:
12/16/2021
Inventors:
Toshinori MIURA, Mitsuru KEKURA, Naoto KAMEDA
Title:
DEGRADABLE RESIN MOLDING AND PRODUCTION METHOD FOR DEGRADABLE RESIN MOLDING
Assignment: 1
Reel/Frame:
059941/0369Recorded: 05/18/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/16/2021
Exec Dt:
12/14/2021
Exec Dt:
02/04/2022
Assignee:
1-1, OSAKI 2-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 141-6029
Correspondent:
FOLEY & LARDNER LLP
3000 K STREET NW
WASHINGTON, DC 20007

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