Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17074369
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Filing Dt:
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10/19/2020
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Publication #:
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Pub Dt:
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02/04/2021
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Inventors:
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Cheng-Hsiung Tsai, Chung-Ju Lee, Shau-Lin Shue, Tien-I Bao
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Title:
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Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE, LLP (24061) IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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05/28/2024 09:55 AM
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