Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17324548
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Filing Dt:
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05/19/2021
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Publication #:
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Pub Dt:
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09/02/2021
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Inventors:
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Chunho Kim, Mark R. Boone, Randolph E. Crutchfield
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 710 MEDTRONIC PARKWAY NE |
| MINNEAPOLIS, MINNESOTA 55432-5604 |
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| JAY R. PRALLE |
| 111 WASHINGTON AVENUE SOUTH |
| SUITE 700 |
| MINNEAPOLIS, MN 55401 |
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