Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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16591056
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Filing Dt:
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10/02/2019
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Publication #:
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Pub Dt:
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04/09/2020
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Inventors:
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Gernot Schulz, Gernot Gmundner
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Title:
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Package With Embedded Electronic Component Being Encapsulated in a Pressureless Way
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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FABRIKSGASSE 13 |
LEOBEN, AUSTRIA 8700 |
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SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
50 GLENLAKE PARKWAY |
SUITE 340 |
ATLANTA, GA 30328 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST INVENTOR'S LAST NAME PREVIOUSLY RECORDED AT REEL: 050998 FRAME: 0062. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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FABRIKSGASSE 13 |
LEOBEN, AUSTRIA 8700 |
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SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
1600 PARKWOOD CIRCLE SE, SUITE 620 |
ATLANTA, GA 30339 |
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06/24/2024 07:03 PM
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