Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2023
|
Application #:
|
17179904
|
Filing Dt:
|
02/19/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2021
| | | | |
|
Inventors:
|
Fong-yuan CHANG, Chin-Chou LIU, Chin-Her CHIEN, Cheng-Hung YEH, Po-Hsiang HUANG et al
|
|
Title:
|
Through-Silicon Vias in Integrated Circuit Packaging
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| 1100 NEW YORK AVE, NW |
| WASHINGTON, DC 20005 |
|
|
Search Results as of:
05/29/2024 03:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
