Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/21/2023
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Application #:
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17037051
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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07/08/2021
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Inventors:
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Yi LU, Xiaohui ZHUANG, Yihui LIN, Liang WANG, Le LI, Kaige GAO, Wenjie ZHU, Jialin ZHAO
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Title:
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FORMING METAL PLUG THROUGH A HOLE IN A DEVICE INCLUDING A RESISTANCE LAYER AND CONTACTING EMBEDDED CONDUCTIVE STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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18 ZHANGJIANG ROAD, PUDONG NEW AREA |
SHANGHAI, CHINA 201203 |
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NO.18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT |
BEIJING, CHINA 100716 |
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ANOVA LAW GROUP C/O SMIC |
21495 RIDGETOP CIRCLE |
SUITE 300 |
STERLING, VA 20166 |
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09/23/2024 04:38 PM
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