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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/28/2023
Application #:
16320041
Filing Dt:
01/23/2019
Publication #:
Pub Dt:
10/28/2021
Inventors:
Wei Li, Guangcai Yuan, Bin Zhou, Dongfang Wang, Jun Cheng, Yingbin Hu, Jingjing Xia et al
Title:
Photoresist Composition, its Manufacturing Method, and Manufacturing Methods of Metal Pattern and Array Substrate
Assignment: 1
Reel/Frame:
048113/0086Recorded: 01/23/2019Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2018
Exec Dt:
12/26/2018
Exec Dt:
01/02/2019
Exec Dt:
12/26/2018
Exec Dt:
12/26/2018
Exec Dt:
12/26/2018
Exec Dt:
12/26/2018
Exec Dt:
12/26/2018
Assignees:
XINZHAN INDUSTRIAL PARK
ANHUI
HEFEI, CHINA 230012
NO. 10 JIUXIANQIAO RD.
CHAOYANG DISTRICT
BEIJING, CHINA 100015
Correspondent:
BANNER & WITCOFF, LTD.
71 SOUTH WACKER DRIVE
SUITE 3600
CHICAGO, IL 60606-7407

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