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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/14/2023
Application #:
17873727
Filing Dt:
07/26/2022
Publication #:
Pub Dt:
02/23/2023
Inventors:
Sung Hoon HONG, Hyun Jin CHANG, Hyun Chul LEE, Jack WOO
Title:
OVERLAY MARK, OVERLAY MEASUREMENT METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE OVERLAY MARK
Assignment: 1
Reel/Frame:
060626/0658Recorded: 07/26/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/23/2022
Exec Dt:
07/22/2022
Exec Dt:
07/25/2022
Exec Dt:
07/22/2022
Assignee:
#15-23, DONGTANSANDAN 6-GIL, DONGTAN-MYEON
HWASEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 18487
Correspondent:
NOVICK, KIM & LEE, PLLC
3251 OLD LEE HIGHWAY, SUITE 500
FAIRFAX, VA 22030

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