Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2023
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Application #:
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17392462
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Filing Dt:
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08/03/2021
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Publication #:
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Pub Dt:
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12/22/2022
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Inventors:
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Chih-Ming Huang, Chang-Fu Lin, Yu-Lung Huang, Kuo-Hua Yu
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Title:
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FLIP-CHIP PROCESS AND BONDING EQUIPMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.123, SEC. 3, DAFENG RD., TANZI DIST. |
| TAICHUNG CITY, TAIWAN 427 |
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| SCOTT W. KELLEY |
| 6320 CANOGA AVENUE |
| SUITE 1650 |
| WOODLAND HILLS, CA 91367 |
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