Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2023
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Application #:
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16608917
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Filing Dt:
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10/28/2019
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Publication #:
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Pub Dt:
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04/22/2021
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Inventor:
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Takehiro WADA
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Title:
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SOLDER ALLOY, SOLDER JOINT MATERIAL, AND ELECTRONIC CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 32-1, SENJU ASAHI-CHO, ADACHI-KU, |
| TOKYO, JAPAN 120-0026 |
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| CLARK & BRODY |
| 1700 DIAGONAL ROAD |
| SUITE 310 |
| ALEXANDRIA, VA 22314 |
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