Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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17199371
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Filing Dt:
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03/11/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Inventor:
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Yu-Lung Wen
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Title:
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ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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EMPLOYMENT CONTRACT OF YU-LUNG WEN WITH RICHWAVE TECHNOLOGY CORP.
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3F, NO. 1, ALLEY 20, LANE 407, SECTION 2, TIDING BLVD., NEIHU DISTRICT |
TAIPEI CITY, TAIWAN |
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WINSTON HSU |
5F., NO.389, FUHE RD., YONGHE DIST., |
NEW TAIPEI CITY, TAIWAN |
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09/26/2024 05:58 PM
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