Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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17336752
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Filing Dt:
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06/02/2021
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Publication #:
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Pub Dt:
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09/16/2021
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Inventors:
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Akihiko WATANABE, Masaaki ONODERA
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Title:
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MOLDED FOAM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 598-1, TATSUMAE-CHO, NAKADACHIURI-SAGARU, KARASUMADORI, KAMIGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 602-0912 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, 22314 UNITED STATES |
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