Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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17671394
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Filing Dt:
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02/14/2022
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Publication #:
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Pub Dt:
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05/26/2022
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Inventors:
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Cheng-Hsiung Tsai, Chih Wei Lu, Chung-Ju Lee, Chieh-Han Wu
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Title:
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METHOD OF FABRICATING SELF-ALIGNED VIA STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP (24061) IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, 75219 UNITED STATES |
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