Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2023
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Application #:
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17327297
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Filing Dt:
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05/21/2021
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Publication #:
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Pub Dt:
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09/09/2021
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Inventors:
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Weijian PAN, Zhixiang HU, Dan YANG
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Title:
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PCB-PINOUT BASED PACKAGED MODULE AND METHOD FOR PREPARING PCB-PINOUT BASED PACKAGED MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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05/27/2024 02:45 PM
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