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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/09/2023
Application #:
17307405
Filing Dt:
05/04/2021
Publication #:
Pub Dt:
11/10/2022
Inventors:
Feng Zhou, Hiroshi Ukegawa, Ercan Mehmet Dede
Title:
CHIP-ON-CHIP POWER DEVICES EMBEDDED IN PCB AND COOLING SYSTEMS INCORPORATING THE SAME
Assignment: 1
Reel/Frame:
056129/0958Recorded: 05/04/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/29/2021
Exec Dt:
04/29/2021
Exec Dt:
04/29/2021
Assignee:
6565 HEADQUARTERS DRIVE W1-3C
PLANO, TEXAS 75024
Correspondent:
DINSMORE & SHOHL LLP
255 E. 5TH STREET
SUITE 1900
CINCINNATI, OH 45202
Assignment: 2
Reel/Frame:
063884/0721Recorded: 06/07/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/02/2023
Assignee:
1, TOYOTA-CHO
TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET
SUITE 1900
CINCINNATI, OH 45202

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