Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17391130
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Filing Dt:
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08/02/2021
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Publication #:
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Pub Dt:
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02/02/2023
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Inventors:
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Xian Bin Xu, Xiong Min Zhang, Bao Huang Chen, Qing Hui Lu, Chen-Hsin Chang, Po-Pin Hung
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Title:
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BONDING STRUCTURE AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4F, 515 JISHAN NORTH ROAD, XIAMEN TORCH HIGH-TECH INDUSTRIAL DEVELOPMENT ZONE |
| XIAMEN, FUJIAN, CHINA |
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| COOPER LEGAL GROUP, LLC |
| 6505 ROCKSIDE ROAD |
| SUITE 330 |
| INDEPENDENCE, OH 44131 |
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