Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17355566
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Filing Dt:
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06/23/2021
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Publication #:
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Pub Dt:
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12/29/2022
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Inventors:
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Shu-Wei Li, Ming-Han Lee, Shin-Yi Yang, Shau-Lin Shue
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Title:
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INTERCONNECT STRUCTURE WITH HYBRID BARRIER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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ESCHWEILER & POTASHNIK, LLC |
ROSETTA CENTER |
629 EUCLID AVE., SUITE 1101 |
CLEVELAND, OH 44114 |
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09/25/2024 10:56 AM
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