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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/16/2023
Application #:
16442801
Filing Dt:
06/17/2019
Publication #:
Pub Dt:
12/17/2020
Inventors:
Shenavia S. Howell, John J. Beatty, Raymond A. Krick, Suzana Prstic
Title:
PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
Assignment: 1
Reel/Frame:
049484/0496Recorded: 06/17/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/13/2019
Exec Dt:
06/13/2019
Exec Dt:
06/13/2019
Exec Dt:
06/12/2019
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
MICHAEL SEAN MOORE
2816 LAGO VISTA LANE
PATENT CAPITAL GROUP
ROCKWALL, TX 75032

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