Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2023
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Application #:
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17815950
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Filing Dt:
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07/29/2022
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Inventors:
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Jia-Liang CHEN, Chi-Ming YANG, Yen-Chao LIN
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Title:
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METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 10, LI-HSIN 6TH ROAD, HSINCHU SCIENCE PARK |
HSINCHU CITY, TAIWAN 30078 |
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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CKC & PARTNERS CO., LLC |
12345 LAKE CITY WAY NE, NO. 283 |
SEATTLE, WA 98125 |
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06/18/2024 01:01 AM
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